My research applies coarse-grained molecular dynamics to model epoxy resin networks, enabling efficient simulation of thermoset curing, crosslinking, and mechanical performance. Through virtual tensile and shear testing, I investigate how formulation and processing variables affect the structural integrity and functional behavior of these materials. This approach provides molecular-level insights into fracture toughness, stiffness, and failure mechanisms, offering a predictive tool for engineering high-performance epoxy systems in applications ranging from lightweight composites to smart sensing materials.